기간
2024-08-28 ~ 2024-08-30

장소
Exhibition Hall (위치보기)

관람시간
10:00-17:00 (Fri 16:30)

입장료
10,000 KRW (Free of charge for pre-registrants)

주최/주관
Gyeonggi-do, Suwon City / Suwon Convention Center, Electronic Times, J.EXPO CO., LTD.

후원사
Korea Packaging Intergration Association, Advanced Institute of Convergence Technology, Korea Eelectroincs Technology Institute, The Korean Association of Microelectronics Packaging, The Korean Microelectornic and Packaging Society, SoBuJang Technology Collaboration Forum, Hanyang Center for Advanced Semiconductor Packaging, HYU LINC 3.0

전화번호
02-6285-9131

팩스번호
02-6285-9137

홈페이지

담당자
Jaeho Lee

e-Mail
[email protected]

행사목적
A festivity of semiconductor packaging technology

행사품목
Semiconductor Packaging & Test Equipment
Semiconductor Packaging Materials & Parts
Semiconductor Packaging Technical Solutions
Other Semiconductor Back-end Processing Materials, Parts, and Equipment

행사내용